IPC Publication

H
ELECTRICITY

Note(s)

  • These Notes cover the basic principles and general instructions for use of section H.
    • Section H covers:
      • basic electric elements, which cover all electric units and the general mechanical structure of apparatus and circuits, including the assembly of various basic elements into what are called printed circuits and also cover to a certain extent the manufacture of these elements (when not covered elsewhere);
      • generation of electricity, which covers the generation, conversion and distribution of electricity together with the controlling of the corresponding gear;
      • applied electricity, which covers:
        • general utilisation techniques, viz. those of electric heating and electric lighting circuits;
        • some special utilisation techniques, either electric or electronic in the strict sense, which are not covered by other sections of the Classification, including:
          • electric light sources, including lasers;
          • electric X-ray technique;
          • electric plasma technique and the generation and acceleration of electrically charged particles or neutrons;
      • basic electronic circuits and their control;
      • radio or electric communication technique;
      • the use of a specified material for the manufacture of the article or element described. In this connection, paragraphs 88 to 90 of the Guide should be referred to.
    • In this section, the following general rules apply:
      • Subject to the exceptions stated in I(c), above, any electric aspect or part peculiar to a particular operation, process, apparatus, object or article, classified in one of the sections of the Classification other than section H, is always classified in the subclass for that operation, process, apparatus, object or article. Where common characteristics concerning technical subjects of similar nature have been brought out at class level, the electric aspect or part is classified, in conjunction with the operation, process, apparatus, object or article, in a subclass which covers entirely the general electrical applications for the technical subject in question;
      • The electrical applications referred to under (a), above, either general or particular, include:
        • the therapeutic processes and apparatus, in class A61;
        • the electric processes and apparatus used in various laboratory or industrial operations, in classes B01 and B03 and in subclass B23K;
        • the electricity supply, electric propulsion and electric lighting of vehicles in general and of particular vehicles, in the subsection "Transporting" of section B;
        • the electric ignition systems of internal-combustion engines, in subclass F02P, and of combustion apparatus in general, in subclass F23Q;
        • the whole electrical part of section G, i.e. measuring devices including apparatus for measuring electric variables, checking, signalling and calculating. Electricity in that section is generally dealt with as a means and not as an end in itself;
      • All electrical applications, both general and particular, presuppose that the "basic electricity" aspect appears in section H (see I(a) above) as regards the electric "basic elements" which they comprise. This rule is also valid for applied electricity, referred to in I(c), above, which appears in section H itself.
H01
ELECTRIC ELEMENTS

Note(s) [7]

  • Processes involving only a single technical art, e.g. drying, coating, for which provision exists elsewhere are classified in the relevant class for that art.
  • Attention is drawn to the Notes following the titles of class B81 and subclass B81B relating to "microstructural devices" and "microstructural systems".
DH01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10 (use of semiconductor devices for measuring G01; resistors in general H01C; magnets, inductors or transformers H01F; capacitors in general H01G; electrolytic devices H01G 9/00; batteries or accumulators H01M; waveguides, resonators or lines of the waveguide type H01P; line connectors or current collectors H01R; stimulated-emission devices H01S; electromechanical resonators H03H; loudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers H04R; electric light sources in general H05B; printed circuits, hybrid circuits, casings or constructional details of electrical apparatus, manufacture of assemblages of electrical components H05K; use of semiconductor devices in circuits having a particular application, see the subclass for the application) [2]
Warning: In this subclass, reclassification of PCT Minimum Documentation is not yet completed! Due to the ongoing developments in class H10 and related subclasses, the information displayed in notes, references and definitions of this subclass may not be entirely accurate. For each specific subject matter referred to in this subclass, users are invited to consult the relevant place in class H10 and to consider the class H10 information as correct, in case of conflict.

Note(s) [2010.01]

  • This subclass is residual to class H10.
  • This subclass covers :
    • semiconductor devices for rectifying, amplifying, oscillating or switching; their constructional details or arrangements; their assemblies or integrated devices; their manufacture or treatment;
    • semiconductor devices sensitive to radiation; their constructional details or arrangements; their assemblies or integrated devices; their manufacture or treatment;
    • semiconductor devices for light emission; their constructional details or arrangements; their assemblies or integrated devices; their manufacture or treatment;
    • processes or apparatus for the manufacture or treatment of semiconductor or solid-state devices where the type of device is not listed under bullets a to c, above, or not essential;
    • constructional details or arrangements of semiconductor or solid-state devices not covered by class H10 and not specific to types of devices listed under bullets a to c, above;
    • packaging or assembling of semiconductor or solid-state devices covered by this subclass or by class H10.
  • In this subclass, the following terms or expressions are used with the meaning indicated:
    • "wafer" means a slice of semiconductor or crystalline substrate material, which can be modified by impurity diffusion (doping), ion implantation or epitaxy, and whose active surface can be processed into arrays of discrete components or integrated circuits;
    • "solid state body" means the body of material within which, or at the surface of which, the physical effects characteristic of the device occur;
    • "electrode" is a region in or on the body of the device (other than the solid state body itself), which exerts an electrical influence on the solid state body, irrespective of whether or not an external electrical connection is made thereto. An electrode may include several portions and the term includes metallic regions which exert influence on the solid state body through an insulating region (e.g. capacitive coupling) and inductive coupling arrangements to the body. The dielectric region in a capacitive arrangement is regarded as part of the electrode. In arrangements including several portions, only those portions which exert an influence on the solid state body by virtue of their shape, size, or disposition or the material of which they are formed are considered to be part of the electrode. The other portions are considered to be "arrangements for conducting electric current to or from the solid state body" or "interconnections between solid state components formed in or on a common substrate", i.e. leads;
    • "device" means an electric circuit element; where an electric circuit element is one of a plurality of elements formed in or on a common substrate it is referred to as a "component";
    • "complete device" is a device in its fully assembled state which may or may not require further treatment, e.g. electroforming, before it is ready for use but which does not require the addition of further structural units;
    • "parts" includes all structural units which are included in a complete device;
    • "container" is an enclosure forming part of the complete device and is essentially a solid construction in which the body of the device is placed, or which is formed around the body without forming an intimate layer thereon. An enclosure which consists of one or more layers formed on the body and in intimate contact therewith is referred to as an "encapsulation";
    • "integrated circuit" is a device where all components, e.g. diodes or resistors, are built up on a common substrate and form the device including interconnections between the components;
    • "assembly" of a device is the building up of the device from its constructional units; the term covers the provision of fillings in containers.
  • In this subclass, both the process or apparatus for the manufacture or treatment of a device and the device itself are classified, whenever both of these are described sufficiently to be of interest.
  • Attention is drawn to Note (3) after the title of section C, which Note indicates to which version of the Periodic Table of chemical elements the IPC refers. In this subclass, the system used is the 8 group system indicated by Roman numerals in the Periodic Table thereunder.